Multichip modules and related technologies MCM, TAB and COB design

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Bibliographic Details
Main Author:	Ginsberg, Gerald L
Other Authors:	Schnorr, Donald P
Format:	Unknown
Published:	New York McGraw Hill 1994
Series:	Electronic packaging and interconnection series
Subjects:	Multichip modules (Microelectronics) > Design and construction Electronic packinging
Online Access:	Click Here to View Status and Holdings.
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MARC


LEADER	00000n a2200000 a 4501
001	wils-98454
020	#	#	\|a 007023552X
090	0	0	\|a TK7870.15 \|b .G563 1994
100	1	#	\|a Ginsberg, Gerald L
245	1	1	\|a Multichip modules and related technologies \|b MCM, TAB and COB design \|c Gerald L. Ginsberg, Donald P. Scnorr
260	#	#	\|a New York \|b McGraw Hill \|c 1994
300	#	#	\|a xiv, 290 p. \|b ill. \|c 24 cm
490	1	#	\|a Electronic packaging and interconnection series
500	#	#	\|a Cover title: Multichip modules & related technologies
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Multichip modules (Microelectronics) \|x Design and construction
650	#	0	\|a Electronic packinging
700	1	#	\|a Schnorr, Donald P
745	#	#	\|a Multichip modules & related technologies
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=98454
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam
998	#	#	\|a 00260##a002.8.2\|\|00260##b002.8.4\|\|00260##c002.7.6\|\|00300##a003.4.1\|\|00300##b003.6.1\|\|00300##c003.5.1\|\|00500##a002.17.2\|\|