Multichip modules and related technologies MCM, TAB and COB design
Saved in:
Main Author: | |
---|---|
Other Authors: | |
Format: | Unknown |
Published: |
New York
McGraw Hill
1994
|
Series: | Electronic packaging and interconnection series
|
Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|