Ultra-thin chip technology and applications

Saved in:

Bibliographic Details
Other Authors:	Burghartz, Joachim N.
Format:	Unknown
Published:	New York Springer 2011
Subjects:	Integrated circuits > Wafer-scale integration Integrated circuits > Wafer-scale integration > Design and construction Microelectronics > Wafer-scale integration > Design and construction
Online Access:	Click Here to View Status and Holdings.
Tags:	Add Tag No Tags, Be the first to tag this record!

MARC


LEADER	00000n a2200000 a 4501
001	wils-439824
020	#	#	\|a 1441972757
020	#	#	\|a 9781441972750
040	#	#	\|a BIP US \|d ITMB
090	0	0	\|a TK7874 \|b .U48 2011
245	0	0	\|a Ultra-thin chip technology and applications \|c Joachim N. Burghartz, editor
260	#	#	\|a New York \|b Springer \|c 2011
300	#	#	\|a xxii, 467 p. \|b ill.(some col.) \|c 24 cm
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Integrated circuits \|x Wafer-scale integration
650	#	0	\|a Integrated circuits \|x Wafer-scale integration \|x Design and construction
650	#	0	\|a Microelectronics \|x Wafer-scale integration \|x Design and construction
700	1	#	\|a Burghartz, Joachim N.
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=439824
964	#	#	\|c BOK \|d EE
998	#	#	\|a 00260##a002.8.2\|\|00260##b002.8.4\|\|00260##c002.7.6\|\|00300##a003.4.1\|\|00300##b003.6.1\|\|00300##c003.5.1\|\|