Ultra-thin chip technology and applications

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Bibliographic Details
Other Authors:	Burghartz, Joachim N.
Format:	Unknown
Published:	New York Springer 2011
Subjects:	Integrated circuits > Wafer-scale integration Integrated circuits > Wafer-scale integration > Design and construction Microelectronics > Wafer-scale integration > Design and construction
Online Access:	Click Here to View Status and Holdings.
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