Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology-2003 presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

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Bibliographic Details
Other Authors:	Lee, R. Ricky
Format:	Book
Published:	New York, N.Y. American Society of Mechanical Engineers 2003
Series:	EPP vol. 3
Subjects:	Nanotechnology > Congresses Electronic packaging > Congresses Photonics > Congresses Microelectronic packaging > Congresses Surface mount technology > Congresses Microelectromechanical systems > Congresses > Wafer-scale integration Integrated circuits > Congresses > Wafer-scale integration
Online Access:	Click Here to View Status and Holdings.
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