Multichip module technology handbook

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Bibliographic Details
Main Author:	Garrou, Philip E.
Format:	Book
Published:	New York McGraw-Hill 1998
Series:	Electronic packaging and interconnection series
Subjects:	Integrated circuits > Very large scale integration > Design and construction Microelectronic packaging Microchip modules (Microlectronics)
Online Access:	Click Here to View Status and Holdings.
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LEADER	00000n a2200000 a 4501
001	wils-205172
020	#	#	\|a 0070228949
090	0	0	\|a TK7874.G372 1998
100	1	#	\|a Garrou, Philip E.
245	1	1	\|a Multichip module technology handbook \|c Philip E. Garrou and Iwona Turlik
260	#	#	\|a New York \|b McGraw-Hill \|c 1998
300	#	#	\|a xxii,ca. 1100 p. \|b ill. \|c 23 cm
490	1	#	\|a Electronic packaging and interconnection series
500	#	#	\|a Includes index
650	#	0	\|a Integrated circuits \|x Very large scale integration \|x Design and construction
650	#	0	\|a Microelectronic packaging
650	#	0	\|a Microchip modules (Microlectronics)
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=205172
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam