Multichip module technology handbook

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Bibliographic Details
Main Author:	Garrou, Philip E.
Format:	Book
Published:	New York McGraw-Hill 1998
Series:	Electronic packaging and interconnection series
Subjects:	Integrated circuits > Very large scale integration > Design and construction Microelectronic packaging Microchip modules (Microlectronics)
Online Access:	Click Here to View Status and Holdings.
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