Multichip module technology handbook
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Main Author: | |
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Format: | Book |
Published: |
New York
McGraw-Hill
1998
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Series: | Electronic packaging and interconnection series
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Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
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Item Description: | Includes index |
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Physical Description: | xxii,ca. 1100 p. ill. 23 cm |
ISBN: | 0070228949 |