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  1. 1
    Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology-2003 presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

    Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology-2003 presented at the 2003 ASME International Mechanical Engineering Congress : Novemb...

    Published 2003
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  2. 2
    Ultra-thin chip technology and applications

    Ultra-thin chip technology and applications

    Published 2011
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  3. 3
    Wafer level 3-d ics process technology

    Wafer level 3-d ics process technology

    Published 2008
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    Fault covering problems in reconfigurable VLSI systems

    Fault covering problems in reconfigurable VLSI systems

    Published 1992
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