Search Results

Suggested Topics within your search.
  • Showing 1 - 17 results of 17
Refine Results
  1. 1
    Flip chip technologies

    Flip chip technologies

    Published 1996
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  2. 2
    Microelectronics technology polymers for advanced imaging and packaging developed from a symposium sponsored by the ACS Division of Polymeric Materials ...

    Microelectronics technology polymers for advanced imaging and packaging developed from a symposium sponsored by the ACS Division of Polymeric Materials ...

    Published 1995
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  3. 3
    Multichip module technology handbook

    Multichip module technology handbook by Garrou, Philip E.

    Published 1998
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  4. 4
    Mems and microsystems design and manufacture design and manufacture

    Mems and microsystems design and manufacture design and manufacture by Hsu, Tai-Ran

    Published 2002
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  5. 5
    RF measurements of die and packages

    RF measurements of die and packages by Wartenberg, Scott A.

    Published 2002
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  6. 6
    Area array packaging materials adhesives, pastes, and lead-free

    Area array packaging materials adhesives, pastes, and lead-free

    Published 2004
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  7. 7
    Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology-2003 presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

    Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology-2003 presented at the 2003 ASME International Mechanical Engineering Congress : Novemb...

    Published 2003
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  8. 8
    IC component sockets

    IC component sockets by Liu, Weifeng

    Published 2004
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  9. 9
    Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

    Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

    Published 2005
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  10. 10
    Microelectronic packaging

    Microelectronic packaging

    Published 2005
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  11. 11
    MEMS packaging

    MEMS packaging

    Published 2004
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  12. 12
    Physical design essentials an ASIC design implementation perspective

    Physical design essentials an ASIC design implementation perspective by Golshan,Khosrow

    Published 2007
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  13. 13
    Integrated circuit packaging, assembly, and interconnections

    Integrated circuit packaging, assembly, and interconnections by Greig, William J.

    Published 2007
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  14. 14
    MEMS and microsystems design, manufacture, and nanoscale engineering

    MEMS and microsystems design, manufacture, and nanoscale engineering by Hsu, Tai-Ran

    Published 2008
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  15. 15
    Three-dimensional integration and modeling a revolution in RF and wireless packaging

    Three-dimensional integration and modeling a revolution in RF and wireless packaging

    Published 2008
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  16. 16
    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing

    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing by Liu S. Sheng

    Published 2011
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:
  17. 17
    Encyclopedia of thermal packaging

    Encyclopedia of thermal packaging

    Published 2015
    Click Here to View Status and Holdings.
    Unknown

    Save to List
    Saved in:

Search Tools: