Multilevel interconnect technology

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Bibliographic Details
Main Author: Rao, Gopal K
Format: Book
Published: New York McGraw-Hill 1993
Series:Intel/McGraw-Hill series
Subjects:
Online Access:Click Here to View Status and Holdings.
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245 1 1 |a Multilevel interconnect technology  |c Gopal K. Rao 
260 # # |a New York  |b McGraw-Hill  |c 1993 
300 # # |a xv, 224 p.  |b ill.  |c 24 cm 
490 1 # |a Intel/McGraw-Hill series 
504 # # |a Includes bibliographical references and index 
650 # 0 |a Integrated circuits  |x Very large scale integration  |x Reliability 
650 # 0 |a Electronic circuit design 
650 # 0 |a Production engineering 
650 # 0 |a Integrated circuits  |x Very large scale integration  |x Design and construction 
856 4 0 |z Click Here to View Status and Holdings.  |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=92414 
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