Encyclopedia of thermal packaging

Encyclopedia of thermal packaging Set Thermal packaging tools

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Bibliographic Details
Other Authors: Bar-Cohen, Avram 1946-, Iyengar, Madhusudan, Geisler, Karl J. L., Sammakia, Bahgat 1952-, Lasance, Clements, Mohammed-Nabil, Sabry, Srivastava, Ankur, Sapatnekar, Sachin, Shi, Bing 1952-, Zhang, Yufu 1946-
Format: Book
Published: New Jersey World Scientific 2015
Subjects:
Microelectronic packaging
Insulation (Heat)
Electronic apparatus and appliances > Cooling
Online Access:Click Here to View Status and Holdings.
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245 0 0 |a Encyclopedia of thermal packaging  |c editor-in-chief, Avram Bar-Cohen, University of Maryland, USA  |n Set  |p Thermal packaging tools 
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500 # # |a "A guide to cooling of electronic equipment." 
504 # # |a Includes bibliographical references and index 
505 0 # |a v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research / editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia -- v. 2. Energy optimization and thermal management of data centers / Bahgat Sammakia, Yogend -- v. 3. Compact thermal models of electronic components / Clements Lasance, Mohammed- Nabil Sabry -- v.4. Thermally-informed deesign of microelectronic components / Ankur Srivastava, Sachin Sapatnekar, Bing Shi, Yufu Zhang 
650 # 0 |a Microelectronic packaging 
650 # 0 |a Insulation (Heat) 
650 # 0 |a Electronic apparatus and appliances  |x Cooling 
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700 1 # |a Geisler, Karl J. L. 
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700 1 # |a Lasance, Clements 
700 1 # |a Mohammed-Nabil, Sabry 
700 1 # |a Srivastava, Ankur 
700 1 # |a Sapatnekar, Sachin 
700 1 # |a Shi, Bing  |d 1952- 
700 1 # |a Zhang, Yufu  |d 1946- 
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