Soldering for electronic assemblies

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Bibliographic Details
Main Author:	Lambert, Leo P
Format:	Book
Published:	New York Marcel Dekker 1988
Series:	Manufacturing engineering and materials processing 25
Subjects:	Solder and soldering Printed circuits
Online Access:	Click Here to View Status and Holdings.
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MARC


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001	wils-48851
020	#	#	\|a 082477681X
090	0	0	\|a TT267 \|b .L33 1988
100	1	#	\|a Lambert, Leo P
245	1	1	\|a Soldering for electronic assemblies \|c Leo P. Lambert
260	#	#	\|a New York \|b Marcel Dekker \|c 1988
300	#	#	\|a ix, 351 p. \|b ill. \|c 24 cm
490	1	#	\|a Manufacturing engineering and materials processing \|v 25
504	#	#	\|a Includes bibliographies and index.
650	#	0	\|a Solder and soldering
650	#	0	\|a Printed circuits
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=48851
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam
998	#	#	\|a 00260##a002.8.2\|\|00260##b002.8.4\|\|00260##c002.7.6\|\|00300##a003.4.1\|\|00300##b003.6.1\|\|00300##c003.5.1\|\|