Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing

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Bibliographic Details
Main Author:	Liu S. Sheng
Other Authors:	Liu, Yong 1962-
Format:	Book
Published:	Beijing Chemical Industry Press 2011
Subjects:	Microelectronic packaging > Simulation methods
Online Access:	Click Here to View Status and Holdings.
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020	#	#	\|a 9780470827802 (hbk.)
020	#	#	\|a 0470827807 (hbk.)
040	#	#	\|a DLC \|d ITMB
090	0	0	\|a TK7870.15 \|b .L58 2011
100	1	#	\|a Liu S. \|q Sheng
245	1	0	\|a Modeling and simulation for microelectronic packaging assembly \|b manufacturing, reliability, and testing \|c Sheng Liu and Yong Liu
260	#	#	\|a Beijing \|b Chemical Industry Press \|c 2011
300	#	#	\|a xxii, 564 p. \|b ill. \|c 26 cm
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Microelectronic packaging \|x Simulation methods
700	1	#	\|a Liu, Yong \|c 1962-
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=474187
964	#	#	\|c BOK \|d EM
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