Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing
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| Format: | Book |
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Beijing
Chemical Industry Press
2011
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| Online Access: | Click Here to View Status and Holdings. |
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Add Tag | Physical Description: | xxii, 564 p. ill. 26 cm |
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| Bibliography: | Includes bibliographical references and index |
| ISBN: | 9780470827802 (hbk.) 0470827807 (hbk.) |
Microelectronic packaging 
Microelectronics theory, design, and fabrication.