Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Saved in:
Bibliographic Details
Main Author: Li, Er-Ping
Corporate Authors: Wiley Online Library (Online service), Ohio Library and Information Network
Format: Unknown
Published: United States IEEE Press 2012
Subjects:
Online Access:Click Here to View Status and Holdings.
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items