Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
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Main Author: | Li, Er-Ping |
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Corporate Authors: | Wiley Online Library (Online service), Ohio Library and Information Network |
Format: | Unknown |
Published: |
United States
IEEE Press
2012
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Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
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