Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

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Bibliographic Details
Main Author:	Li, Er-Ping
Corporate Authors:	Wiley Online Library (Online service), Ohio Library and Information Network
Format:	Unknown
Published:	United States IEEE Press 2012
Subjects:	Three-dimensional integrated circuits
Online Access:	Click Here to View Status and Holdings.
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