Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
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Format: | Book |
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United States
IEEE Press
2012
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Online Access: | Click Here to View Status and Holdings. |
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LEADER | 00000n a2200000 a 4501 | ||
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001 | wils-474137 | ||
020 | # | # | |a 9780470623466 (hbk.) |
020 | # | # | |a 0470623462 (hbk.) |
040 | # | # | |a DG1 |d ITMB |
090 | 0 | 0 | |a TK7874.893 |b .E7 2012 |
100 | 1 | # | |a Li, Er-Ping |
245 | 1 | 0 | |a Electrical modeling and design for 3D system integration |b 3D integrated circuits and packaging, signal integrity, power integrity and EMC |c Er-Ping Li |
260 | # | # | |a United States |b IEEE Press |c 2012 |
300 | # | # | |a xiv, 366 p. |b ill. |c 25 cm |
504 | # | # | |a Includes bibliographical references and index |
650 | # | 0 | |a Three-dimensional integrated circuits |
710 | 1 | # | |a Wiley Online Library (Online service) |
710 | # | # | |a Ohio Library and Information Network |
856 | 4 | 0 | |z Click Here to View Status and Holdings. |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=474137 |
964 | # | # | |c BOK |d EM |