Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

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Bibliographic Details
Main Author:	Li, Er-Ping
Corporate Authors:	Wiley Online Library (Online service), Ohio Library and Information Network
Format:	Unknown
Published:	United States IEEE Press 2012
Subjects:	Three-dimensional integrated circuits
Online Access:	Click Here to View Status and Holdings.
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090	0	0	\|a TK7874.893 \|b .E7 2012
100	1	#	\|a Li, Er-Ping
245	1	0	\|a Electrical modeling and design for 3D system integration \|b 3D integrated circuits and packaging, signal integrity, power integrity and EMC \|c Er-Ping Li
260	#	#	\|a United States \|b IEEE Press \|c 2012
300	#	#	\|a xiv, 366 p. \|b ill. \|c 25 cm
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Three-dimensional integrated circuits
710	1	#	\|a Wiley Online Library (Online service)
710	#	#	\|a Ohio Library and Information Network
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=474137
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