Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

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Bibliographic Details
Main Author: Li, Er-Ping
Corporate Authors: Wiley Online Library (Online service), Ohio Library and Information Network
Format: Book
Published: United States IEEE Press 2012
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Online Access:Click Here to View Status and Holdings.
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001 wils-474137
020 # # |a 9780470623466 (hbk.) 
020 # # |a 0470623462 (hbk.) 
040 # # |a DG1  |d ITMB 
090 0 0 |a TK7874.893  |b .E7 2012 
100 1 # |a Li, Er-Ping 
245 1 0 |a Electrical modeling and design for 3D system integration  |b 3D integrated circuits and packaging, signal integrity, power integrity and EMC  |c Er-Ping Li 
260 # # |a United States  |b IEEE Press  |c 2012 
300 # # |a xiv, 366 p.  |b ill.  |c 25 cm 
504 # # |a Includes bibliographical references and index 
650 # 0 |a Three-dimensional integrated circuits 
710 1 # |a Wiley Online Library (Online service) 
710 # # |a Ohio Library and Information Network 
856 4 0 |z Click Here to View Status and Holdings.  |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=474137 
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