Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
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| Corporate Authors: | , |
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United States
IEEE Press
2012
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| Online Access: | Click Here to View Status and Holdings. |
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Add Tag | Physical Description: | xiv, 366 p. ill. 25 cm |
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| Bibliography: | Includes bibliographical references and index |
| ISBN: | 9780470623466 (hbk.) 0470623462 (hbk.) |
3D integration for VLSI systems 
Integrated circuit packaging, assembly, and interconnections