Power electronic packaging design, assembly process, reliability and modeling
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Format: | Unknown |
Published: |
London
Springer
2012
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Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
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LEADER | 00000n a2200000 a 4501 | ||
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001 | wils-473857 | ||
020 | # | # | |a 9781461410522 (hbk.) |
020 | # | # | |a 1461410525 (hbk.) |
040 | # | # | |a GW5XE |d ITMB |
090 | 0 | 0 | |a TK7870.15 |b .L58 2012 |
100 | 1 | # | |a Liu, Yong |c 1962- |
245 | 1 | 0 | |a Power electronic packaging |b design, assembly process, reliability and modeling |c Yong Liu |
260 | # | # | |a London |b Springer |c 2012 |
300 | # | # | |a xviii, 591 p. |b ill. (some col.) |c 24 cm |
504 | # | # | |a Icludes bibliographical references and index |
650 | # | 0 | |a Electronic packaging |
650 | # | 0 | |a Power electronics |
856 | 4 | 0 | |z Click Here to View Status and Holdings. |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=473857 |
964 | # | # | |c BOK |d EE |
998 | # | # | |a 00260##a003.5.1||00260##b003.5.1||00260##c003.5.1||00300##a003.5.1||00300##b003.5.1||00300##c003.5.1|| |