Power electronic packaging design, assembly process, reliability and modeling

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Bibliographic Details
Main Author: Liu, Yong 1962-
Format: Unknown
Published: London Springer 2012
Subjects:
Online Access:Click Here to View Status and Holdings.
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020 # # |a 9781461410522 (hbk.) 
020 # # |a 1461410525 (hbk.) 
040 # # |a GW5XE  |d ITMB 
090 0 0 |a TK7870.15  |b .L58 2012 
100 1 # |a Liu, Yong  |c 1962- 
245 1 0 |a Power electronic packaging  |b design, assembly process, reliability and modeling  |c Yong Liu 
260 # # |a London  |b Springer  |c 2012 
300 # # |a xviii, 591 p.  |b ill. (some col.)  |c 24 cm 
504 # # |a Icludes bibliographical references and index 
650 # 0 |a Electronic packaging 
650 # 0 |a Power electronics 
856 4 0 |z Click Here to View Status and Holdings.  |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=473857 
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