Reactive sputter deposition
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Other Authors: | , |
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Format: | Book |
Published: |
Berlin, NY
Springer
2008
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Series: | Springer series in materials science
109 |
Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
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LEADER | 00000nam a2200000 4501 | ||
---|---|---|---|
001 | wils-446588 | ||
005 | 201502318811 | ||
008 | 110919s2008 gw eng | ||
020 | # | # | |a 3540766626 (hbk.) |
020 | # | # | |a 9783540766629 (hbk.) |
040 | # | # | |a DLC |d ITMB |
090 | 0 | 0 | |a TS695 |b .R43 2008 |
245 | 0 | 0 | |a Reactive sputter deposition |c D. Depla, S. Mahieu, editors |
260 | # | # | |a Berlin, NY |b Springer |c 2008 |
300 | # | # | |a xviii, 570 p. |b ill. (some col.) |c 25 cm |
490 | 1 | # | |a Springer series in materials science |v 109 |
504 | # | # | |a Includes bibliographical references and index |
650 | # | 1 | |a Thin films |
650 | # | # | |a Cathode sputtering (Plating process) |
700 | 1 | # | |a Depla, D. |
700 | # | # | |a Mahieu, S. |
856 | 4 | 0 | |z Click Here to View Status and Holdings. |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=446588 |
964 | # | # | |c BOK |d AS |
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