Wafer level 3-d ics process technology

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Bibliographic Details
Other Authors:	Tan, Chuan Seng, Gutmann, Ronald J., Reif, Rafael
Format:	Unknown
Published:	New York Springer 2008
Series:	Series on integrated circuits and systems
Subjects:	Integrated circuits > Wafer-scale integration
Online Access:	Click Here to View Status and Holdings.
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020	#	#	\|a 9780387765327 (hbk. : alk. paper)
020	#	#	\|a 0387765328 (hbk. : alk. paper)
040	#	#	\|a DLC \|d ITMB
090	0	0	\|a TK7874 \|b .W34 2008
245	0	0	\|a Wafer level 3-d ics process technology \|c Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, editors
260	#	#	\|a New York \|b Springer \|c 2008
300	#	#	\|a xiv, 358p. \|b ill. \|c 24 cm
490	1	#	\|a Series on integrated circuits and systems
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Integrated circuits \|x Wafer-scale integration
700	1	#	\|a Tan, Chuan Seng
700	#	#	\|a Gutmann, Ronald J.
700	#	#	\|a Reif, Rafael
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=446572
964	#	#	\|c BOK \|d AS
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