Three-dimensional integration and modeling a revolution in RF and wireless packaging

Three-dimensional integration and modeling a revolution in RF and wireless packaging

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Bibliographic Details
Format:	Unknown
Published:	San Rafael Morgan & Claypool 2008
Series:	Synthesis lectures on computational electromagnetics v.17
Subjects:	Microelectronic packaging Millimeter wave communication systems Wireless communication systems
Online Access:	Click Here to View Status and Holdings.
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