Three-dimensional integration and modeling a revolution in RF and wireless packaging

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Bibliographic Details
Format:	Unknown
Published:	San Rafael Morgan & Claypool 2008
Series:	Synthesis lectures on computational electromagnetics v.17
Subjects:	Microelectronic packaging Millimeter wave communication systems Wireless communication systems
Online Access:	Click Here to View Status and Holdings.
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001	wils-426511
020	#	#	\|a 9781598294736 (hbk.)
020	#	#	\|a 1598294733 (hbk.)
020	#	#	\|a 9781598292442 (pbk.)
020	#	#	\|a 1598292447 (pbk.)
040	#	#	\|a DLC \|d ITMB
090	0	0	\|a TK7874 \|b .T435 2008
245	0	0	\|a Three-dimensional integration and modeling \|b a revolution in RF and wireless packaging \|c Jong-Hoon Lee, Manos M. Tentzeris
260	#	#	\|a San Rafael \|b Morgan & Claypool \|c 2008
300	#	#	\|a vi, 108 p. \|b ill. \|c 24 cm
490	1	#	\|a Synthesis lectures on computational electromagnetics \|v v.17
504	#	#	\|a Includes bibliographical references
650	#	0	\|a Microelectronic packaging
650	#	0	\|a Millimeter wave communication systems
650	#	0	\|a Wireless communication systems
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=426511
964	#	#	\|c BOK \|d EE
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