Defects in Microelectronic Materials and Devices

Uncover the Defects that Compromise Performance and ReliabilityAs microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes requi...

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Bibliographic Details
Other Authors: Fleetwood, Daniel M. (Editor), Pantelides, Sokrates T. (Editor), Schrimpf, Ronald Donald (Editor)
Format: Book
Language:English
Published: Boca Raton CRC Press 2009
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Online Access:Click Here to View Status and Holdings.
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520 # # |a Uncover the Defects that Compromise Performance and ReliabilityAs microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them. A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface 
650 # 0 |a Microelectronics  |x Testing  |x Materials 
650 # 0 |a Metal oxide semiconductor field-effect transistors  |x Testing 
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700 1 # |a Schrimpf, Ronald Donald  |e editor 
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