ELECTRONIC ASSEMBLY Soft Soldering and Wire Wrapping

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Bibliographic Details
Main Author: Herrick, Gerry (Author)
Format: Book
Language:English
Published: Englewood Cliffs, N.J. Prentice Hall 1992
©1992
Subjects:
Online Access:Click Here to View Status and Holdings.
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001 wils-395217
005 2021124101945
008 210224t1992 NJU a 001 eng D
020 # # |a 0132487667  |q hardback 
040 # # |a DLC  |b eng  |c DLC  |d UiTM  |e rda 
041 0 # |a eng 
090 0 0 |a TK7870  |b .H445 1992 
100 1 # |a Herrick, Gerry  |e author 
245 1 0 |a ELECTRONIC ASSEMBLY  |b Soft Soldering and Wire Wrapping  |c Gerry Herrick 
264 # 1 |a Englewood Cliffs, N.J.  |b Prentice Hall  |c 1992 
264 # 1 |c ©1992 
300 # # |a xiv, 168 pages  |b illustrations  |c 25 cm 
336 # # |a text  |2 rdacontent 
337 # # |a unmediated  |2 rdamedia 
338 # # |a volume  |2 rdacarrier 
504 # # |a Includes bibliographical references (p. 161-162) and index 
650 # 0 |a Electronic apparatus and appliances  |x Design and construction 
650 # 0 |a Solder and soldering 
856 4 0 |z Click Here to View Status and Holdings.  |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=395217 
964 # # |c BOK  |d 01