Integrated circuit packaging, assembly, and interconnections

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Bibliographic Details
Main Author:	Greig, William J.
Format:	Unknown
Published:	New York Springer 2007
Subjects:	Integrated circuits Microelectronic packaging Interconnects (Integrated circuit technology) Integrated circuits industry
Online Access:	Click Here to View Status and Holdings.
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100	1	#	\|a Greig, William J.
245	1	0	\|a Integrated circuit packaging, assembly, and interconnections \|c William J. Greig.
260	#	#	\|a New York \|b Springer \|c 2007
300	#	#	\|a xxiv, 296 p. \|b ill. \|c 24 cm
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Integrated circuits
650	#	0	\|a Microelectronic packaging
650	#	0	\|a Interconnects (Integrated circuit technology)
650	#	0	\|a Integrated circuits industry
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=379495
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