Integrated circuit packaging, assembly, and interconnections

Integrated circuit packaging, assembly, and interconnections

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Bibliographic Details
Main Author: Greig, William J.
Format: Unknown
Published: New York Springer 2007
Subjects:
Integrated circuits
Microelectronic packaging
Interconnects (Integrated circuit technology)
Integrated circuits industry
Online Access:Click Here to View Status and Holdings.
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Description
Physical Description:xxiv, 296 p. ill. 24 cm
Bibliography:Includes bibliographical references and index
ISBN:0387281533 (hbk.)
9780387281537 (hbk.)

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