Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC)
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Corporate Author: | |
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Format: | Book |
Published: |
Warrendale, PA
Society of Automotive Engineers
2004
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Series: | SP
1857 |
Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
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001 | wils-370200 | ||
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040 | # | # | |a GAT |d ITMB |
090 | 0 | 0 | |a TL272.5 |b .S64 2004 |
245 | 1 | 0 | |a Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC) |
260 | # | # | |a Warrendale, PA |b Society of Automotive Engineers |c 2004 |
300 | # | # | |a 222 p. |b ill. |c 28 cm |
490 | 1 | # | |a SP |v 1857 |
500 | # | # | |a "SAE/SP-1857"--Tp verso |
500 | # | # | |a "March 2004" |
504 | # | # | |a Includes bibliographical references |
650 | # | 0 | |a Automobiles |x Electronic equipment |x Congresses |
650 | # | 0 | |a Automobiles |x Electric equipment |x Congresses |
650 | # | 0 | |a Electronic packaging |x Congresses |
650 | # | 0 | |a Electromagnetic compatibility |v Congresses |
710 | 1 | # | |a Society of Automotive Engineers |
840 | 0 | 0 | |a SP (Society of Automotive Engineers) |v SP-1857 |
856 | 4 | 0 | |z Click Here to View Status and Holdings. |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=370200 |
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