Advances in thermal modeling of electronic components and systems

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Bibliographic Details
Other Authors:	Kraus, Allan D 1946-, Bar-Cohen, Avram 1946-
Format:	Unknown
Published:	New York ASME Press 1993
Subjects:	Thermal stresses Termodinamica
Online Access:	Click Here to View Status and Holdings.
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020	0	0	\|a 0791800180
020	0	0	\|a 9780791800188
040	#	#	\|a LIN \|d ITMB
090	0	0	\|a TA418.58 \|b .C6 1993
245	1	0	\|a Advances in thermal modeling of electronic components and systems \|c editors Avram Bar-Cohen, Allan D. Kraus
260	0	0	\|a New York \|b ASME Press \|c 1993
300	0	0	\|a xii, 402 p. \|b ill. \|c 24 cm
500	0	0	\|a Vol.3
504	0	0	\|a Includes bibliographical references and index
650	#	0	\|a Thermal stresses
650	#	0	\|a Termodinamica
700	1	1	\|a Kraus, Allan D \|d 1946-
700	1	1	\|a Bar-Cohen, Avram \|d 1946-
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=369035
964	#	#	\|c BOK \|d 01