Advances in thermal modeling of electronic components and systems
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| Other Authors: | , |
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| Format: | Book |
| Published: |
New York
ASME Press
1993
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| Online Access: | Click Here to View Status and Holdings. |
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| LEADER | 00000n a2200000 a 4501 | ||
|---|---|---|---|
| 001 | wils-369035 | ||
| 020 | 0 | 0 | |a 0791800180 |
| 020 | 0 | 0 | |a 9780791800188 |
| 040 | # | # | |a LIN |d ITMB |
| 090 | 0 | 0 | |a TA418.58 |b .C6 1993 |
| 245 | 1 | 0 | |a Advances in thermal modeling of electronic components and systems |c editors Avram Bar-Cohen, Allan D. Kraus |
| 260 | 0 | 0 | |a New York |b ASME Press |c 1993 |
| 300 | 0 | 0 | |a xii, 402 p. |b ill. |c 24 cm |
| 500 | 0 | 0 | |a Vol.3 |
| 504 | 0 | 0 | |a Includes bibliographical references and index |
| 650 | # | 0 | |a Thermal stresses |
| 650 | # | 0 | |a Termodinamica |
| 700 | 1 | 1 | |a Kraus, Allan D |d 1946- |
| 700 | 1 | 1 | |a Bar-Cohen, Avram |d 1946- |
| 856 | 4 | 0 | |z Click Here to View Status and Holdings. |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=369035 |
| 964 | # | # | |c BOK |d 01 |
Advances in thermal modeling of electronic components and systems