Advances in thermal modeling of electronic components and systems
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Other Authors: | , |
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Format: | Book |
Published: |
New York
ASME Press
1998
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Series: | ASME Press Series
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Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
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LEADER | 00000n a2200000 a 4501 | ||
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001 | wils-368971 | ||
020 | 0 | 0 | |a 0791800652 |
020 | 0 | 0 | |a 9780791800652 |
040 | # | # | |a LIN |d ITMB |
090 | 0 | 0 | |a TA418.58 |b .C6 1998 |
245 | 0 | 0 | |a Advances in thermal modeling of electronic components and systems |c editors Avram Bar-Cohen, Allan D. Kraus |
260 | 0 | 0 | |a New York |b ASME Press |c 1998 |
300 | 0 | 0 | |a x, 459 p. |b ill. |c 25 cm |
490 | 0 | 0 | |a ASME Press Series |
500 | 0 | 0 | |a Vol.4 |
504 | 0 | 0 | |a Incldues bibliographical references and index |
650 | # | 0 | |a Thermal stresses |
650 | # | 0 | |a Termodinamica |
700 | 1 | 1 | |a Bar-Cohen, Avram |d 1946- |
700 | 1 | 1 | |a Kraus, Allan D |
856 | 4 | 0 | |z Click Here to View Status and Holdings. |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=368971 |
964 | # | # | |c BOK |d 01 |