MEMS packaging

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Bibliographic Details
Corporate Author:	INSPEC
Other Authors:	Hsu, Tai-Ran
Format:	Unknown
Published:	London INSPEC 2004
Series:	EMIS processing series no. 3
Subjects:	Microelectronic packaging Microelectromechanical systems
Online Access:	Click Here to View Status and Holdings.
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MARC


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020	#	#	\|a 9780863413353
040	#	#	\|a UKM \|d ITMB
090	0	0	\|a TK7874 \|b .M46 2004
245	0	0	\|a MEMS packaging \|c edited by Tai-Ran Hsu
260	#	#	\|a London \|b INSPEC \|c 2004
300	#	#	\|a xxix, 275 p. \|b ill. \|c 26 cm
490	1	#	\|a EMIS processing series \|v no. 3
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Microelectronic packaging
650	#	0	\|a Microelectromechanical systems
700	1	#	\|a Hsu, Tai-Ran
710	1	#	\|a INSPEC
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=367754
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