MEMS packaging

MEMS packaging

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Bibliographic Details
Corporate Author: INSPEC
Other Authors: Hsu, Tai-Ran
Format: Unknown
Published: London INSPEC 2004
Series:EMIS processing series no. 3
Subjects:
Microelectronic packaging
Microelectromechanical systems
Online Access:Click Here to View Status and Holdings.
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Description
Physical Description:xxix, 275 p. ill. 26 cm
Bibliography:Includes bibliographical references and index
ISBN:0863413358
9780863413353

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