Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices

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Bibliographic Details
Main Author:	Yeh, L.T. Yeh 1944-
Other Authors:	Chu, R. C. 1933- Richard C.
Format:	Unknown
Published:	New York ASME Press 2002
Series:	ASME Press book series on electronic packaging
Subjects:	Electronic apparatus and appliances > Cooling Electronic apparatus and appliances > Thermal properties Heat > Transmission
Online Access:	Click Here to View Status and Holdings.
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020	#	#	\|a 9780791801680
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090	0	0	\|a TK7870.25 \|b .Y44 2002
100	1	#	\|a Yeh, L.T. Yeh \|d 1944-
245	1	1	\|a Thermal management of microelectronic equipment \|b heat transfer theory, analysis methods and design practices \|c L. T. Yeh and R. C. Chu
260	#	#	\|a New York \|b ASME Press \|c 2002
300	#	#	\|a xxi, 414 p. \|b ill. \|c 24 cm
490	1	#	\|a ASME Press book series on electronic packaging
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Electronic apparatus and appliances \|x Cooling
650	#	0	\|a Electronic apparatus and appliances \|x Thermal properties
650	#	0	\|a Heat \|x Transmission
700	1	#	\|a Chu, R. C. \|d 1933- \|q Richard C.
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=361259
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