Adhesives and sealants basic concepts and high tech bonding

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Bibliographic Details
Other Authors: Cognard, Philippe
Format: Book
Published: Amsterdam San Diego, CA Oxford Elsevier 2005
Edition:1st ed
Series:Handbook of adhesives and sealants ; v. 1
Subjects:
Online Access:Click Here to View Status and Holdings.
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020 # # |a 0080445543 (hbk.) 
090 0 0 |a TP968  |b .A289 2005 
245 1 1 |a Adhesives and sealants  |b basic concepts and high tech bonding  |c series editor, Phillipe Cognard 
250 # # |a 1st ed 
260 # # |a Amsterdam  |a San Diego, CA  |a Oxford  |b Elsevier  |c 2005 
300 # # |a xxii, 492 p.  |b ill. (some col.)  |c 25 cm 
490 1 # |a Handbook of adhesives and sealants ; v. 1 
504 # # |a Includes bibliographical references and index 
650 # 0 |a Sealing compounds 
650 # 0 |a Adhesives 
700 1 # |a Cognard, Philippe 
856 4 0 |z Click Here to View Status and Holdings.  |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=345414 
964 # # |c BOK  |d 01 
040 # # |a Shah Alam