Microelectronic packaging
Saved in:
Other Authors: | ?Osaka, Tetsuya 1945-, Schultze, J. W. (Joachim Walter), Datta, Madhav |
---|---|
Format: | Unknown |
Published: |
Boca Raton, FL
CRC Press
2005
|
Series: | New trends in electrochemical technology ;
v. 3 |
Subjects: | |
Online Access: | Click Here to View Status and Holdings. |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing
by: Liu S. Sheng
Published: (2011) -
Microelectronics theory, design, and fabrication.
by: Keonjian, Edward
Published: (1963) -
Area array packaging materials adhesives, pastes, and lead-free
Published: (2004) -
Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements
Published: (2005) -
Encyclopedia of thermal packaging
Published: (2015)