Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

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Bibliographic Details
Other Authors:	Cohn, Charles, Harper, Charles A
Format:	Unknown
Published:	New York McGraw-Hill 2005
Series:	McGraw-Hill professional engineering
Subjects:	Microelectronic packaging Integrated circuits > Fault tolerance
Online Access:	Click Here to View Status and Holdings.
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