Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

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Bibliographic Details
Other Authors: Cohn, Charles, Harper, Charles A
Format: Unknown
Published: New York McGraw-Hill 2005
Series:McGraw-Hill professional engineering
Subjects:
Online Access:Click Here to View Status and Holdings.
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Description
Physical Description:xix, 363 p. ill. 24 cm
Bibliography:Includes bibliographical references and index
ISBN:0071434844