Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements
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| Other Authors: | , |
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| Format: | Book |
| Published: |
New York
McGraw-Hill
2005
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| Series: | McGraw-Hill professional engineering
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| Subjects: | |
| Online Access: | Click Here to View Status and Holdings. |
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Add Tag | Physical Description: | xix, 363 p. ill. 24 cm |
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| Bibliography: | Includes bibliographical references and index |
| ISBN: | 0071434844 |
Microelectronic packaging