Area array packaging materials adhesives, pastes, and lead-free

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Bibliographic Details
Other Authors:	Gilleo, Ken
Format:	Book
Published:	New York McGraw-Hill 2004
Subjects:	Ball grid array technology Microelectronic packaging
Online Access:	Click Here to View Status and Holdings.
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MARC


LEADER	00000n a2200000 a 4501
001	wils-309841
020	#	#	\|a 0071428283
090	0	0	\|a TK7870.15 \|b .G544 2004
245	1	1	\|a Area array packaging materials \|b adhesives, pastes, and lead-free \|c Ken Gilleo
260	#	#	\|a New York \|b McGraw-Hill \|c 2004
300	#	#	\|a viii, 166 p. \|b ill. \|c 25 cm
650	#	0	\|a Ball grid array technology
650	#	0	\|a Microelectronic packaging
700	1	#	\|a Gilleo, Ken
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=309841
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam