Electronic packaging of high speed circuity

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Bibliographic Details
Main Author:	Konsoswki, Stephen G
Other Authors:	Helland, Arden R
Format:	Book
Published:	New York McGraw Hill 1997
Series:	Electronic packaging and interconnection series
Subjects:	Electronic packaging Microwave devices > Design and construction
Online Access:	Click Here to View Status and Holdings.
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MARC


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090	0	0	\|a TK7870 \|b .K647 1997
100	1	#	\|a Konsoswki, Stephen G
245	1	1	\|a Electronic packaging of high speed circuity \|c Stephen G. Konsoswki, Arden R. Helland
260	#	#	\|a New York \|b McGraw Hill \|c 1997
300	#	#	\|a xxi, 445 p. \|b ill. \|c 25 cm
490	1	#	\|a Electronic packaging and interconnection series
500	#	#	\|a Includes index
650	#	0	\|a Electronic packaging
650	#	0	\|a Microwave devices \|x Design and construction
700	1	#	\|a Helland, Arden R
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=213249
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