Characterization of integrated circuit packaging materials

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Bibliographic Details
Other Authors:	Moore, Thomas M, McKenna, Robert G
Format:	Unknown
Published:	Boston Butterworth-Heinemann 1993
Subjects:	Integrated circuits > Design and construction Electronic packaging > Materials
Online Access:	Click Here to View Status and Holdings.
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MARC


LEADER	00000n a2200000 a 4501
001	wils-208479
020	#	#	\|a 0750692677
090	0	0	\|a TK7870.15 \|b .C52 1993
245	1	1	\|a Characterization of integrated circuit packaging materials \|c edited by Thomas M. Moore and Robert G. McKenna
260	#	#	\|a Boston \|b Butterworth-Heinemann \|c 1993
300	#	#	\|a xviii, 274 p. \|b ill. \|c 25 cm
500	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Integrated circuits \|x Design and construction
650	#	0	\|a Electronic packaging \|x Materials
700	1	#	\|a Moore, Thomas M
700	#	#	\|a McKenna, Robert G
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=208479
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam
998	#	#	\|a 00260##a002.8.2\|\|00260##b002.8.4\|\|00260##c002.7.6\|\|00300##a003.4.1\|\|00300##b003.6.1\|\|00300##c003.5.1\|\|00500##a002.17.2\|\|01700##a0011.2.2\|\|