Characterization of integrated circuit packaging materials
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| Other Authors: | , |
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| Format: | Book |
| Published: |
Boston
Butterworth-Heinemann
1993
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| Subjects: | |
| Online Access: | Click Here to View Status and Holdings. |
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Add Tag | Item Description: | Includes bibliographical references and index |
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| Physical Description: | xviii, 274 p. ill. 25 cm |
| ISBN: | 0750692677 |
Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements