Electronic failure analysis handbook techniques and applications for electronic and electrical packages, components, and assemblies

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Bibliographic Details
Main Author:	Martin, Perry L
Format:	Book
Published:	New York McGraw-Hill 1999
Series:	Electronic Packaging and Interconnection Series
Subjects:	Electronics
Online Access:	Click Here to View Status and Holdings.
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020	#	#	\|a 0070410445
090	0	0	\|a TK7870 \|b .M37 1999
100	1	#	\|a Martin, Perry L
245	1	1	\|a Electronic failure analysis handbook \|b techniques and applications for electronic and electrical packages, components, and assemblies \|c Perry L. Martin
260	#	#	\|a New York \|b McGraw-Hill \|c 1999
300	#	#	\|a 1v. (various pagings) \|b ill. \|c 24 cm
490	1	#	\|a Electronic Packaging and Interconnection Series
500	#	#	\|a Includes index
650	#	0	\|a Electronics
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=194863
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam
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