Hybrid assemblies and multichip modules

Hybrid assemblies and multichip modules

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Bibliographic Details
Main Author:	Kear, Fred W.
Format:	Unknown
Published:	New York Marcel Dekker, Inc. 1993
Series:	Manufacturing engineering and materials processing 38
Subjects:	Hybrid intergrated circuits > Design and construction Multichip modules (Microelectronics) > Design and construction
Online Access:	Click Here to View Status and Holdings.
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