Hybrid assemblies and multichip modules

Saved in:

Bibliographic Details
Main Author:	Kear, Fred W.
Format:	Unknown
Published:	New York Marcel Dekker, Inc. 1993
Series:	Manufacturing engineering and materials processing 38
Subjects:	Hybrid intergrated circuits > Design and construction Multichip modules (Microelectronics) > Design and construction
Online Access:	Click Here to View Status and Holdings.
Tags:	Add Tag No Tags, Be the first to tag this record!

Internet