Hybrid assemblies and multichip modules

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Bibliographic Details
Main Author:	Kear, Fred W.
Format:	Book
Published:	New York Marcel Dekker, Inc. 1993
Series:	Manufacturing engineering and materials processing 38
Subjects:	Hybrid intergrated circuits > Design and construction Multichip modules (Microelectronics) > Design and construction
Online Access:	Click Here to View Status and Holdings.
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001	wils-194499
020	#	#	\|a 0824784669
090	0	0	\|a TK7874 \|b .K38 1993
100	1	#	\|a Kear, Fred W.
245	1	1	\|a Hybrid assemblies and multichip modules \|c Fred W. Kear
260	#	#	\|a New York \|b Marcel Dekker, Inc. \|c 1993
300	#	#	\|a x, 278 p. \|b ill. \|c 23 cm
490	1	#	\|a Manufacturing engineering and materials processing \|v 38
504	#	#	\|a Includes bibliographical references and index
650	#	0	\|a Hybrid intergrated circuits \|x Design and construction
650	#	0	\|a Multichip modules (Microelectronics) \|x Design and construction
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=194499
964	#	#	\|c BOK \|d 01
040	#	#	\|a Shah Alam