Physical design for multichip modules

Physical design for multichip modules

Saved in:

Bibliographic Details
Main Author:	Sriram, M. 1966- (Mysore)
Other Authors:	Kang, Sung-Mo 1945-
Format:	Book
Published:	Boston Kluwer Academic Publishers 1994
Series:	The Kluwer international series in engineering and computer science SECS 267
Subjects:	Multichip modules (Microelectronics) > Design and construction Electronic packaging > Design
Online Access:	Click Here to View Status and Holdings.
Tags:	Add Tag No Tags, Be the first to tag this record!

Similar Items

Conceptual design of multichip modules and systems
by: Sandborn, Peter A. 1959-
Published: (1994)

Multichip modules and related technologies MCM, TAB and COB design
by: Ginsberg, Gerald L
Published: (1994)

Multichip modules
Published: (1992)

Introduction to multichip modules
by: Sherwani, N. A. Naveed A
Published: (1995)

Hybrid assemblies and multichip modules
by: Kear, Fred W.
Published: (1993)

Flip chip technologies
Published: (1996)

Multichip module technology handbook
by: Garrou, Philip E.
Published: (1998)

System-in-package RF design and applications
by: Gaynor, Michael P.
Published: (2007)

Microelectronic packaging
Published: (2005)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing
by: Liu S. Sheng
Published: (2011)

Electronic techniques shop practices and construction
by: Villanucci, Robert S. 1944-
Published: (1974)

Electronic packaging of high speed circuity
by: Konsoswki, Stephen G
Published: (1997)

Encyclopedia of thermal packaging
Published: (2015)

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements
Published: (2005)

Area array packaging materials adhesives, pastes, and lead-free
Published: (2004)

Characterization of integrated circuit packaging materials
Published: (1993)

Microelectronics theory, design, and fabrication.
by: Keonjian, Edward
Published: (1963)

Microelectronics theory, design, and fabrication.
by: Keonjian, Edward
Published: (1963)

Physical design of electronic systems
Published: (1970)

Physical design of electronic systems.
Published: (1971)

Physical design of electronic systems.
Published: (1972)

Physical design of electronic systems
Published: (1970)

Practical guide to the packaging of electronics thermal and mechanical design and analysis
by: Jamnia, Ali 1961-
Published: (2009)

Modulation
by: Connor, F. R. (Frank Robert
Published: (1973)

Essentials of electronic packaging a multidisciplinary approach
by: Viswanadham, Puligandla
Published: (2011)

Packaging of electronic systems a mechanical enginering approach
by: Dally, James W
Published: (1990)

Principles of electronic packaging
Published: (1989)

Power electronic packaging design, assembly process, reliability and modeling
by: Liu, Yong 1962-
Published: (2012)

Journal of electronic packaging
Published: (1989)

Materials for electronic packaging
Published: (1995)

Electronic devices a text and software problems manual
by: Schultz, Mitchel E
Published: (1994)

Electronic project design and fabrication
by: Reis, Ronald A

Handbook of polymer coatings for electronics chemistry, technology and applications
by: Licari, James J
Published: (2005)

Lead-free soldering in electronics science, technology and environmental impact
Published: (2004)

Electronic project design and fabrication
by: Reis, Ronald A
Published: (2005)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology-2003 presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.
Published: (2003)

Physical architecture of VLSI systems
Published: (1994)

Electronic packaging and interconnection handbook
by: Harper, Charles A
Published: (2005)

Electronic packaging and interconnection handbook
Published: (2000)

The electronic packaging handbook
Published: (2000)