Physical design for multichip modules

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Bibliographic Details
Main Author:	Sriram, M. 1966- (Mysore)
Other Authors:	Kang, Sung-Mo 1945-
Format:	Book
Published:	Boston Kluwer Academic Publishers 1994
Series:	The Kluwer international series in engineering and computer science SECS 267
Subjects:	Multichip modules (Microelectronics) > Design and construction Electronic packaging > Design
Online Access:	Click Here to View Status and Holdings.
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020	#	#	\|a 079239450X
090	0	0	\|a TK7870.15 \|b .S64 1994
100	1	#	\|a Sriram, M. \|c 1966- \|q (Mysore)
245	1	1	\|a Physical design for multichip modules \|c by M. Sriram, S. M. Kang
260	#	#	\|a Boston \|b Kluwer Academic Publishers \|c 1994
300	#	#	\|a xi, 197 p. \|b ill. \|c 25 cm
490	1	#	\|a The Kluwer international series in engineering and computer science \|v SECS 267
504	#	#	\|a Includes bibliographical references (p. 181-191) and index
650	#	0	\|a Multichip modules (Microelectronics) \|x Design and construction
650	#	0	\|a Electronic packaging \|x Design
700	1	#	\|a Kang, Sung-Mo \|c 1945-
856	4	0	\|z Click Here to View Status and Holdings. \|u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=125788
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