Thin films stresses and mechanical properties III

Saved in:
Bibliographic Details
Corporate Authors: Symposium on Thin Films : Stresses and Mechanical Properties III, Materials Research society
Other Authors: Nix, William D
Format: Book
Published: Pittsburgh, Pa. ill. 24 cm
Series:Materials Research Society symposium proceedings v.239
Subjects:
Online Access:Click Here to View Status and Holdings.
Tags: Add Tag
No Tags, Be the first to tag this record!

MARC

LEADER 00000n a2200000 a 4501
001 wils-103465
020 # # |a 1558991336 
090 0 0 |a TA418.9.T45  |b S95 1992 
110 1 # |a Symposium on Thin Films : Stresses and Mechanical Properties III  |j Boston, Mass  |k 1991 
245 1 1 |a Thin films  |b stresses and mechanical properties III  |b symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A  |c editors, William D. Nix ... [et al.] 
260 # # |a Pittsburgh, Pa.  |b ill.  |c 24 cm 
300 # # |a xv, 725 p.  |b ill.  |c 24 cm 
490 1 # |a Materials Research Society symposium proceedings  |v v.239  |x 0272-9172 
500 # # |a "Papers presented ... at the l99l Fall Meeting of the materials Research Society"--Pref 
504 # # |a Includes bibliographical references ad indexes 
650 # 0 |a Thin films  |x Mechanical properties  |x Congresses 
700 1 # |a Nix, William D 
710 1 # |a Materials Research society 
856 4 0 |z Click Here to View Status and Holdings.  |u https://opac.uitm.edu.my/opac/detailsPage/detailsHome.jsp?tid=103465 
964 # # |c BOK  |d 01 
040 # # |a Shah Alam